Before Making Debut In 2013’s MWC The Specifications Of Sony Xperia SP Has Been Seep Out

There were only 2 days left for the Sony Xperia SP to debut to the mobile world conference held in 2013. But before appearing in to the show the specifications of Sony Xperia SP revealed. The information that has been gathered from the latest tidbit is this unreleased device is designed with a touchscreen display of 4.6 inches along with the visual resolution of 720p. The chipset is inserted within the frame, which runs on Qualcomm Snapdragon S4 Pro MSM8960T one. This stands out that SONY has decorated the device with the dual core of 1.7GHz processor along with a graphics supported by Adreno 320 muscle.


It has been estimated an 8MP Exmor RS main camera is sited on the back panel of the device. When it comes to memory than Xperia SP is not behind from the rival manufacturers as 8GB of RAM and the freedom of escalating the memory with a microSD card slot is an added bonus for the users. The weight of the device is advertized to be 155grams.

The information hovered from Xperia Blog displayed that the entire construction of the handset caries specialization because the handset will appear with the plastic coated on the rear panel and the aluminum has a vital role on the remaining four sides. Meanwhile, we must confess that it is little tricky to have the assurance of presenting the expected features on the device.

There is a big question whether Sony Xperia SP will arrive and disclosed its specifications on MWC 2013 or else before making an announcement, the brand will wait to end all the rumors that have been circulating on the market relating to Xperia SP.

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